Thermal Flow Rate Evaluation System for Low Thermal Resistance Multilayer Substrates
F-CAL

Inquiries about this product

低熱抵抗多層基板用熱流量評価装置 F-CALイメージ

Inquiries about this product

It is possible to measure the multilayer materials, which is difficult with the laser flash method.
This system is to measure the heat flow rate of a sample.
A heating block is contact with the high temperature side of the sample, and the low temperature side of the sample is contacted with a low temperature block which works as both a cooling and a heat flow meter to perform measurement.v
It is possible to measure the heat flow rate flowing from the hot side to the cold side of the sample in a steady state.
The thermal resistance of the unknown sample can be evaluated by comparing with the thermal flow measurement results of a standard sample with known thermal resistance.

Applications

  • Composite of metal + resin
  • Composite of ceramic and metal
  • Composite of carbon and semiconductor
  • Evaluation of anisotropic materials

Features

  • Heat flow rate (thermal resistance) in the thickness direction can be evaluated
  • It is convertible to thermal resistivity using reference sample (Cu・SUS304, etc.)
  • It is possible to meaure thermal resistance of a sample wich is made by joining a thin sheet material and a metal material

Specifications

Measured physical properties Heat flow rate (thermal resistance)
Temperature range 50°C (Heating block set temperature)
Module size 25mm or 40mm square x thickness 1 to 5mm
Measuring atmosphere In the atmosphere

Utilities

System dimensions Approximately W800 x D800 x H1800(mm) (Main body)
Approximately W300 x D430 x H675(mm) (constant temperature water circulator)
Weight Approx. 250 kg
Required power supply Main body:Single-phase AC200V, 5kW
thermostatic water circulator:Single-phase AC100V, 1.6kW
PC:Single-phase AC100V, 1kW

Sample system block

Example of measurement data

40mm Square Sample Heat-Block 50°C Temperature rise

Research Paper List

Development of a Thermal Resistance Evaluation Device Using a Flow Calorimeter
Thermal Physical Properties p. 16-21 No. 1, Vol. 37, 2023
DOI : https://doi.org/10.2963/jjtp.37.16

Analysis service by using this product

Thermal Flow Rate Evaluation System for Low Thermal Resistance Multilayer Substrates F-CAL Contact form

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