Scanning Thermal Probe Micro-image
STPM-1000

2 dimensional distribution of Seebeck coefficient and thermal conductivity measurement system by thermal probe
STPM-1000 is used for evaluating Seebeck coefficient and thermal conductivity simultaneously. Simple evaluation of thermoelectric materials is possible by simultaneous evaluations of seebeck coefficient and thermal conductivity. The thermal conductivity distribution evaluation of functionally graded materials, multilayer substrates and organic materials is also possible. STPM-1000 is expected to use materials evaluation as a basic tool.

Applications

Distribution evaluation of thermoelectric materials
Material development and homogeneity valuation of thermoelectric materials
Homogeneity evaluation of inorganic materials, polymer materials, crystalline materials
Thermal conductivity evaluation of mounting
materials (Printed circuit boards, multilayer boards etc)

Features

Just in 10 seconds for 1 point distribution measurement
Available to perform a mapping analysis at a pitch of 20μm.
Improve better accuracy of thermal conductivity by calibrating with a standard sample
Customizable to □ 50 mm sample (max.)

This system was developed based on a joint patent #5252543 with national institute of advanced industrial science and technology (AIST)

Specifications

Type	STPM-1000
Measurement temperature	RT + 5 °C
Maximum sample size	Square 20 mm × Thickness 5 mm
Accuracy of Seebeck coefficient	± 10 % (by single bulk sample with thickness 1mm)
Accuracy of thermal conductivity	± 50 % (by single bulk sample with thickness 1mm)
Measurement time at one point	less than 10 s.
Local resolution	20 μm
Resolution of position control	1 μm
Sample moving distance	x-axis 50 mm, y-axis 50 mm, z-axis 10 mm
Power supply	AC 100V 15 A (excluding PC)
External dimensions	W510 × D650 × t460 (mm)
Weight	Approx. 70kg
Space requirement	Approx. W1200 × D900 (mm) for table

※Thermal conductivity of unknown sample can be estimated by reference sample of known thermal conductivity and comparison calibration.

Measurement principle

Seebeck coefficient
Calculate from voltage difference (ΔV) and temperature difference (ΔV) beteween temperature at contact point T_cp and T₃.
(Tcp is calculated from T₁ and T₂.)

Thermal conductivity
Calculate from T₁ - T₂.

Measurement examples

Seebeck coefficient and thermal conductivity distribution and composition dependence of Seebeck coefficient and thermal conductivity of (Bi_1-xSb_x)₂Te₃(0.5

Seebeck coefficient distribution

Thermal conductivity distribution

Composition dependence of Seebeck coefficient

Composition dependence of thermal conductivity

Applications

Simple performance evaluation of thermoelectric materials
Thermal property distribution evaluation of functionally graded materials
Homogeneity evaluation of inorganic materials, polymer materials and crystalline materials
Defect assessment of practical materials (Print substrate, multilayer substrate etc.)

Utility

Power supply	AC 100V 15A (excluding PC)
External dimensions	W510 × D650 × t460 (mm)
Weight	Approx. 70kg
Space requirement	Approx. W1200 × D900 (mm) for table

Analysis service by using this product