This system is a compact desktop type of RTP-6 for conventional infrared-heating system.
We have achieved quiet heating with efficient cooling and reduced noise with eliminating the conventional heat exhaust unit and adopting a cooling fan.
Features
- High-speed heating of small chips and thin wafers up to 2, 4, and 6 inches
- Simple operation of Temperature Recipe with Original Program Software
- Achieved a significant reduction in noise with a cooling fan
- Cooling water flow checker installed for safety measures
- Mounted a mass flow controller for process gas (N2 gas)
- Enhancement of control systems such as PLC, temperature controllers, touch panels, and over-temperature etc
Specifications
| Temperature range | RT～1000℃ max.1100℃ |
|---|---|
| Sample size | Standard φ6-inch wafer 1pcs (Please contact us for other wafer shapes) |
| Atmosphere | In N2 gas flow/in vacuum (vacuum exhaust system is option) |
| Heating method | Upper single-side heating system using parabolic reflection infrared lamp |
| Maximum heating rate | 10°C/s (using a SiC coated carbon susceptor) |
| Temperature uniformity | ΔT = 10℃ 2 minutes after holing at 800℃, during N 2 gas-flow (using a SiC coated carbon susceptor) |
| Control sensor | Thermocouple JIS-K |
Utilities
| System dimensions | Approx. W600 × D660 × H780 (mm) |
|---|---|
| Weight | Approx. 100 kg |
| Required power supply | Three-phase AC200V, 100A |
| Required cooling water | 16L/min or more, 0.3MPa or more, 0.4MPa or less (Pressure varies depending on the installation environment) |
| Cooling water scramble | φ19×φ26 Cantouch fitting for tetron blade hose handed over |
| Vacuuming port | KF-16 |
System diagram
