By adding this source to APD series or your vacuum chamber, different “targets” can be deposited simultaneously and materials with new characters can be produced.
- Produce chemical compounds from multiple depositions
- Add to your vacuum chamber
- Due to size uniformity of nanoparticles compared with ones produced through previous wet process, highly active catalysts can be produced.
- Capable of selecting nanoparticle diameter from approx.1.5nm to 6nm
- Capable of generating easily oxide and nitride by changing atmosphere
- Attachable to a vacuum flange of ICF070 (VG50) or equivalent without any consideration of which direction
- Easy maintenance because no water cooling facilities are needed
|Target size||φ 10 × L 17 (mm)|
|Substrate size||φ 2 inch (φ 50 mm)|
|Deposition rate||0.01 ～ 0.3 nm/s *1|
|Film thickness uniformity||Fe: < ± 10 % (φ 20mm area) *1|
|Materials Available for deposition||Conductive materials *2|
*1 Distance from a target to a substrate: 80mm
*2 Specific resistance of a target: 0.01Ωcm or less
Schematic of the Arc Plasma Source(APS)
- Power requirement：AC200V Single phase ±10% 2kVA
- ❶ Condenser box：W110 x D320 x H200 (mm)
- ❷ Body of APS within vacuum chamber：φ34 x L200 (mm)
- ❸ Power supply unit：W200 x D360 x H200 (mm)
- ❹ Controller：W240 x D400 x H200 (mm)
＊Put power supply unit & controller onto the rack.
TEM Images for Nano-Particles prepared by APS
- TEM image of Pt nano-particles supported on
Well-dispersed Pt nano-particles on the carbon powder are deposited.
- TEM image of Pt nono-particles on a substrate
The size of nano-particle becomes larger as the pulse number of arc plasma shots is increased.
- TEM image of Pt thin film
Extremely thin Pt film is formed by a stacking of nano-particles.
Photos of Deposition System installing APS
Table 1 Elements checked for deposition
Checked Limited in use